Thermal Conductive Two-Component RTV Silicone Encapsulant 160 Elastomer for Electronics Potting
Two-component room temperature cure potting compound with mix ratio of 1: 1, curing time can be accelerated by heating up, features with good flow ability and flame resistance. It’s suitable for encapsulating of LED displayers, power module and electronics components, etc.
Thermal Conductive Two-Component RTV Silicone for Electronics Potting
Description
Features of Silicone Rubber For Electronic Encapsulating&Potting
Easy mix with 1: 1 proportion
Low viscosity, high flow ability
Room temperature cure or heat up to accelerate cure
Thermal conduction, flame resistance
No solvent
It can resist high temerature upto 340-360C for about 30 mins.
Technical datasheetof Silicone Rubber For Electronic Encapsulating&Potting
approx values
Viscosity mPa. S 25C 3000~6000
Density g/cm 31.57± 0.02
Pot life min 25C 30min
Curing time 24 hr at RM and at 100C 10 hours
Hardness shore A 55~60
Dielectric strength kv/mm 25C≥ 20
Volume resistivity DC500V Ω Cm3× 1015
Tensile strength Mpa≥ 0.6
Thermal conductivity w/m0.62
Temperature C-30~200
Using Instructions of Silicone Rubber For Electronic Encapsulating&Potting
1. Preparing: Clean up the coating surface, remove the rust, dust, oil dirt and dry .
2. Pouring: Weigh the silicone and catalyst correctly, mix silicone part A and part B thoroughly, pour onto the electronic components/surface and afterwards dovacuum degassing.
3. Curing: Room temperature cure or heat-up for faster cure .
4. The material must be kept in a cool place sealed well, and it should avoid from contact with moisture in the air.
Packaging of Silicone Rubber For Electronic Encapsulating & Potting
Packs are available in 20kg and 100kg lots
Storage & Transportation of Silicone Rubber For Electronic Encapsulating&Potting
1. Keep it from strong sunshine, heat, and store in cool & dry place, well sealed. It has a shelf life of 12 months.
2. It can be stroked and transported as non-dangerous goods.